Sponsorship Opportunities
IEEE BigComp 2027 welcomes organizations interested in supporting the conference and engaging with researchers, developers, and practitioners in big data and smart computing.
About IEEE BigComp 2027
Big data and smart computing are research fields spanning disciplines including computer science, information technology, and the social sciences. Initiated by the Korean Institute of Information Scientists and Engineers (KIISE), IEEE BigComp provides an international forum for researchers, developers, and users from academia, business, and industry to exchange ideas and information on current studies, challenges, research results, system developments, and practical experience.
IEEE BigComp 2027 is co-sponsored by IEEE and KIISE and will be held on January 25–28, 2027 at Fukuoka International Congress Center, Fukuoka, Japan. The conference invites full and short research and industry papers, poster papers, and original work-in-progress reports. It also encourages submissions concerning products, practices, and services in industry.
Conference Information
- Dates: January 25–28, 2027
- Venue: Fukuoka International Congress Center, Fukuoka, Japan
- Expected attendance: Approximately 150 participants
- Official conference website: https://bigcomp2027-website.pages.dev/
- Call for papers: https://bigcomp2027-website.pages.dev/call-for-papers/
- General conference contact: bigcomp2027-contact [at] googlegroups [dot] com
Sponsorship Packages
Choose from three sponsorship levels. All contribution amounts are stated in Japanese yen (JPY) and include tax.
| Benefit | Platinum | Gold | Silver |
|---|---|---|---|
| Sponsorship contribution | JPY 550,000 | JPY 330,000 | JPY 110,000 |
| Logo recognition | Large | Medium | Small |
| Dedicated booth | Included2 panels180 cm-wide table | Included1 panel90 cm-wide table | Not included |
| Poster display | - | - | 1 panel |
| Complimentary registrations | 2 | 1 | None |
Exhibition period: Sponsor booths and poster panels will be available from Monday afternoon, January 25, 2027, until Thursday afternoon, January 28, 2027. Exact times will be announced once confirmed.
Application Process
- Select a sponsorship package.
- Download the Sponsorship Application Form below and fill it in.
- Submit the completed form by email to bigcomp2027-contact [at] googlegroups [dot] com.
- We will contact you after your application form is submitted.
Organization and Sponsorship Contact
General Co-Chairs
- Kazuyuki Shudo, Kyoto University, Japan
- JooYeoun Lee, Ajou University, Korea
Finance Co-Chairs
- Hiroaki Ohshima, University of Hyogo, Japan
- Ha-Joo Song, Pukyong National University, Korea
Sponsor Chair
- Huu-Long Pham, University of Tsukuba, Japan